Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED

The die-bonding layer between chips and substrate determinates the heat conduction efficiency of high-power LED. Sn-based solder, AuSn20 eutectic, and nano-Ag paste were widely applied to LED interconnection. In this paper, the optical–thermal performances and high-temperature reliability of LED wit...

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Detalles Bibliográficos
Autores principales: Liu, Jiaxin, Mou, Yun, Huang, Yueming, Zhao, Jiuzhou, Peng, Yang, Chen, Mingxiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9227735/
https://www.ncbi.nlm.nih.gov/pubmed/35744572
http://dx.doi.org/10.3390/mi13060958

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9227735/
https://www.ncbi.nlm.nih.gov/pubmed/35744572
http://dx.doi.org/10.3390/mi13060958

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