Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps

The use of scaled-down micro-bumps in miniaturized consumer electronic products has led to the easy realization of full intermetallic solder bumps owing to the completion of the wetting layer. However, the direct contact of the intermetallic compounds (IMCs) with the adhesion layer may pose serious...

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Detalles Bibliográficos
Autores principales: Kao, Chen-Wei, Kung, Po-Yu, Chang, Chih-Chia, Huang, Wei-Chen, Chang, Fu-Ling, Kao, C. R.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228047/
https://www.ncbi.nlm.nih.gov/pubmed/35744357
http://dx.doi.org/10.3390/ma15124297

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228047/
https://www.ncbi.nlm.nih.gov/pubmed/35744357
http://dx.doi.org/10.3390/ma15124297

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