Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints

The development of advanced electronic devices leads to highly miniaturized interconnect circuits (ICs), which significantly increases the electromigration (EM) phenomenon of solder and circuits due to higher current density. The electromigration of solder joints under high current density has becom...

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Detalles Bibliográficos
Autores principales: Zhang, Yuanxiang, Zhang, Jicheng, Wang, Yong, Fang, Yike
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228160/
https://www.ncbi.nlm.nih.gov/pubmed/35744565
http://dx.doi.org/10.3390/mi13060953

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228160/
https://www.ncbi.nlm.nih.gov/pubmed/35744565
http://dx.doi.org/10.3390/mi13060953

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