Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization

Surface mount technology (SMT) plays an important role in integrated circuits, but due to thermal stress alternation caused by temperature cycling, it tends to have thermo-mechanical reliability problems. At the same time, considering the environmental and health problems of lead (Pb)-based solders,...

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Detalles Bibliográficos
Autores principales: Liu, Shaoyi, Yan, Yuefei, Zhou, Yijiang, Han, Baoqing, Wang, Benben, Zhang, Daxing, Xue, Song, Wang, Zhihai, Yu, Kunpeng, Shi, Yu, Wang, Congsi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228286/
https://www.ncbi.nlm.nih.gov/pubmed/35744522
http://dx.doi.org/10.3390/mi13060908

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228286/
https://www.ncbi.nlm.nih.gov/pubmed/35744522
http://dx.doi.org/10.3390/mi13060908

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