Cargando…
Understanding the Mechanisms of SiC–Water Reaction during Nanoscale Scratching without Chemical Reagents
Microcracks inevitably appear on the SiC wafer surface during conventional thinning. It is generally believed that the damage-free surfaces obtained during chemical reactions are an effective means of inhibiting and eliminating microcracks. In our previous study, we found that SiC reacted with water...
| Autores principales: | , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9228460/ https://www.ncbi.nlm.nih.gov/pubmed/35744544 http://dx.doi.org/10.3390/mi13060930 |