An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process

The wafer backside grinding process has been a crucial technology to realize multi-layer stacking and chip performance improvement in the three dimension integrated circuits (3D IC) manufacturing. The total thickness variation (TTV) control is the bottleneck in the advanced process. However, the qua...

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Detalles Bibliográficos
Autores principales: Liu, Yuanhang, Tao, Hongfei, Zhao, Dewen, Lu, Xinchun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9229612/
https://www.ncbi.nlm.nih.gov/pubmed/35744288
http://dx.doi.org/10.3390/ma15124230

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9229612/
https://www.ncbi.nlm.nih.gov/pubmed/35744288
http://dx.doi.org/10.3390/ma15124230

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