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An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process
The wafer backside grinding process has been a crucial technology to realize multi-layer stacking and chip performance improvement in the three dimension integrated circuits (3D IC) manufacturing. The total thickness variation (TTV) control is the bottleneck in the advanced process. However, the qua...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9229612/ https://www.ncbi.nlm.nih.gov/pubmed/35744288 http://dx.doi.org/10.3390/ma15124230 |