Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects

The advance of semiconductor technology not only enables integrated circuits with higher density and better performance but also increases their vulnerability to various aging mechanisms which occur from front-end to back-end. Analysis on the impact of aging mechanisms on circuits’ reliability is cr...

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Detalles Bibliográficos
Autores principales: Zhao, Wen-Sheng, Zhang, Rui, Wang, Da-Wei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9230697/
https://www.ncbi.nlm.nih.gov/pubmed/35744497
http://dx.doi.org/10.3390/mi13060883

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9230697/
https://www.ncbi.nlm.nih.gov/pubmed/35744497
http://dx.doi.org/10.3390/mi13060883

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