The Microstructural Evolution of Cu-Sn-P Alloy during Hot Deformation Process

The microstructure evolution of Cu-Sn-P alloy subjected to hot deformation was researched through electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) in the present study. The results indicated that after hot deformation, grains perpendicular to the force direction wer...

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Detalles Bibliográficos
Autores principales: Zhao, Junsheng, Zhang, Limin, Du, Fengming, Yuan, Xia, Wang, Pengfei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9267601/
https://www.ncbi.nlm.nih.gov/pubmed/35806628
http://dx.doi.org/10.3390/ma15134501

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9267601/
https://www.ncbi.nlm.nih.gov/pubmed/35806628
http://dx.doi.org/10.3390/ma15134501

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