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The Microstructural Evolution of Cu-Sn-P Alloy during Hot Deformation Process
The microstructure evolution of Cu-Sn-P alloy subjected to hot deformation was researched through electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) in the present study. The results indicated that after hot deformation, grains perpendicular to the force direction wer...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9267601/ https://www.ncbi.nlm.nih.gov/pubmed/35806628 http://dx.doi.org/10.3390/ma15134501 |