Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO(2) to Additively Manufacture High-Performance Thermosetting Polyimide Composites

The three-dimensional (3D) printing of a SiO(2)-filled thermosetting polyimide (SiO(2)@TSPI) composite with outstanding performance is realized via the direct ink writing (DIW) of polyamide acid (PAA) composite ink and thermal treatment conducted thereafter. The composite ink consists of phenylethyn...

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Detalles Bibliográficos
Autores principales: Li, Keda, Ding, Jinghong, Guo, Yuxiong, Wu, Hongchao, Wang, Wenwen, Ji, Jiaqi, Pei, Qi, Gong, Chenliang, Ji, Zhongying, Wang, Xiaolong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9269254/
https://www.ncbi.nlm.nih.gov/pubmed/35808714
http://dx.doi.org/10.3390/polym14132669

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9269254/
https://www.ncbi.nlm.nih.gov/pubmed/35808714
http://dx.doi.org/10.3390/polym14132669

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