A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies

This letter solves a major hurdle that mars photolithography-based fabrication of micro-mesoscale structures in silicon. Conventional photolithography is usually performed on smooth, flat wafer surfaces to lay a 2D design and subsequently etch it to create single-level features. It is, however, unab...

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Detalles Bibliográficos
Autores principales: Hazra, Sougata, Zhang, Chi, Wu, Qianying, Asheghi, Mehdi, Goodson, Kenneth, Dede, Ercan M., Palko, James, Narumanchi, Sreekant
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9288478/
https://www.ncbi.nlm.nih.gov/pubmed/35842450
http://dx.doi.org/10.1038/s41598-022-16281-5

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9288478/
https://www.ncbi.nlm.nih.gov/pubmed/35842450
http://dx.doi.org/10.1038/s41598-022-16281-5

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