Robust Co alloy design for Co interconnects using a self-forming barrier layer

With recent rapid increases in Cu resistivity, RC delay has become an important issue again. Co, which has a low electron mean free path, is being studied as beyond Cu metal and is expected to minimize this increase in resistivity. However, extrinsic time-dependent dielectric breakdown has been repo...

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Detalles Bibliográficos
Autores principales: Kim, Cheol, Kang, Geosan, Jung, Youngran, Kim, Ji-Yong, Lee, Gi-Baek, Hong, Deokgi, Lee, Yoongu, Hwang, Soon-Gyu, Jung, In-Ho, Joo, Young-Chang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9296516/
https://www.ncbi.nlm.nih.gov/pubmed/35853980
http://dx.doi.org/10.1038/s41598-022-16288-y

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9296516/
https://www.ncbi.nlm.nih.gov/pubmed/35853980
http://dx.doi.org/10.1038/s41598-022-16288-y

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