Effects of Initial Morphology on Growth Kinetics of Cu(6)Sn(5) at SAC305/Cu Interface during Isothermal Aging

Solder/Cu joints are important components responsible for interconnection in microelectronics. Construction of the solder/Cu joints through liquid/solid (L/S) reactions accompanies the formation of the Cu–Sn intermetallic compounds (IMCs) at the joint interface. The Cu(6)Sn(5) IMC exhibits remarkabl...

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Detalles Bibliográficos
Autores principales: Lee, Jia-Yi, Chen, Chih-Ming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9318113/
https://www.ncbi.nlm.nih.gov/pubmed/35888218
http://dx.doi.org/10.3390/ma15144751

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9318113/
https://www.ncbi.nlm.nih.gov/pubmed/35888218
http://dx.doi.org/10.3390/ma15144751

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