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Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playi...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2022
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9324842/ https://www.ncbi.nlm.nih.gov/pubmed/35888552 http://dx.doi.org/10.3390/ma15145086 |