Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures

Most current thermal MEMS use fragile structures such as thin-film membranes or microcantilevers for thermal isolation. To increase the robustness of these devices, solid thermal insulators that are compatible with MEMS cleanroom processing are needed. This work introduces a novel approach for micro...

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Detalles Bibliográficos
Autores principales: Behrmann, Ole, Lisec, Thomas, Gojdka, Björn
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9332110/
https://www.ncbi.nlm.nih.gov/pubmed/35893176
http://dx.doi.org/10.3390/mi13081178

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9332110/
https://www.ncbi.nlm.nih.gov/pubmed/35893176
http://dx.doi.org/10.3390/mi13081178

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