Coupling Supramolecular Assemblies and Reactive Oxygen Species (ROS) with Megasonic Action for Applications in Shallow Trench Isolation (STI) Post-Chemical Mechanical Planarization (p-CMP) Cleaning

[Image: see text] Due to the continued miniaturization of semiconductor devices, slurry formulations utilized in the chemical mechanical planarization (CMP) process have become increasingly complex to meet stringent manufacturing specifications. Traditionally, in shallow trench isolation (STI), CMP,...

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Detalles Bibliográficos
Autores principales: Wortman-Otto, Katherine M., Watson, Don, Dussault, Don, Keleher, Jason J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2022
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9352252/
https://www.ncbi.nlm.nih.gov/pubmed/35936460
http://dx.doi.org/10.1021/acsomega.2c00683

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9352252/
https://www.ncbi.nlm.nih.gov/pubmed/35936460
http://dx.doi.org/10.1021/acsomega.2c00683

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