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Coupling Supramolecular Assemblies and Reactive Oxygen Species (ROS) with Megasonic Action for Applications in Shallow Trench Isolation (STI) Post-Chemical Mechanical Planarization (p-CMP) Cleaning
[Image: see text] Due to the continued miniaturization of semiconductor devices, slurry formulations utilized in the chemical mechanical planarization (CMP) process have become increasingly complex to meet stringent manufacturing specifications. Traditionally, in shallow trench isolation (STI), CMP,...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2022
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9352252/ https://www.ncbi.nlm.nih.gov/pubmed/35936460 http://dx.doi.org/10.1021/acsomega.2c00683 |