3-D stacked polycrystalline-silicon-MOSFET-based capacitorless DRAM with superior immunity to grain-boundary’s influence

In this paper, a capacitorless one-transistor dynamic random access memory (1 T-DRAM) based on a polycrystalline silicon (poly-Si) metal-oxide-semiconductor field-effect transistor with the asymmetric dual-gate (ADG) structure is designed and analyzed through a technology computer-aided design (TCAD) simulation. A poly-Si thin film was used within the device due to its low fabrication cost and feasibility in high-density three-dimensional (3-D) memory arrays. We studied the transfer characteristics and memory performances of the single-layer ADG 1 T-DRAMs and the 3-D stacked ADG 1 T-DRAMs and analyze the reliability depending on the location and the number of grain-boundaries (GBs). The relative standard deviation (RSD) of the threshold voltages (Vth) is depending on the location and the number of GBs. The RSDs of the single-layer ADG 1 T-DRAM and the 3-D stacked ADG 1 T-DRAM are 1.58% and 0.68%, respectively. The RSDs of retention time representing the memory performances are 54.7% and 41%, respectively. As a result of the 3-D stacked structure, the averaging effect occurs, which greatly aids in improving the reliability of the memory performances as well as the transfer characteristics of 1 T-DRAMs depending on the influence of GBs. The proposed 3-D stacked ADG 1 T-DRAM helps implement a high-reliability single-cell memory device.