Hermetic Packaging Based on Cu–Sn and Au–Au Dual Bonding for High-Temperature Graphene Pressure Sensor

A chip-level hermetic package for a high-temperature graphene pressure sensor was investigated. The silicon cap, chip and substrate were stacked by Cu–Sn and Au–Au bonding to enable wide-range measurements while guaranteeing a high hermetic package. Prior to bonding, the sample was treated with Ar (...

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Detalles Bibliográficos
Autores principales: Wang, Junqiang, Zhang, Haikun, Chen, Xuwen, Li, Mengwei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9413212/
https://www.ncbi.nlm.nih.gov/pubmed/36014113
http://dx.doi.org/10.3390/mi13081191

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9413212/
https://www.ncbi.nlm.nih.gov/pubmed/36014113
http://dx.doi.org/10.3390/mi13081191

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