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Hermetic Packaging Based on Cu–Sn and Au–Au Dual Bonding for High-Temperature Graphene Pressure Sensor
A chip-level hermetic package for a high-temperature graphene pressure sensor was investigated. The silicon cap, chip and substrate were stacked by Cu–Sn and Au–Au bonding to enable wide-range measurements while guaranteeing a high hermetic package. Prior to bonding, the sample was treated with Ar (...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9413212/ https://www.ncbi.nlm.nih.gov/pubmed/36014113 http://dx.doi.org/10.3390/mi13081191 |