Electroplated Al Press Marking for Wafer-Level Bonding

Heterogeneous integration of micro-electro mechanical systems (MEMS) and complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) by 3D stacking or wafer bonding is an emerging approach to advance the functionality of microdevices. Aluminum (Al) has been of interest as one of the waf...

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Detalles Bibliográficos
Autores principales: Al Farisi, Muhammad Salman, Tsukamoto, Takashiro, Tanaka, Shuji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9413586/
https://www.ncbi.nlm.nih.gov/pubmed/36014143
http://dx.doi.org/10.3390/mi13081221

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9413586/
https://www.ncbi.nlm.nih.gov/pubmed/36014143
http://dx.doi.org/10.3390/mi13081221

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