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Electroplated Al Press Marking for Wafer-Level Bonding
Heterogeneous integration of micro-electro mechanical systems (MEMS) and complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) by 3D stacking or wafer bonding is an emerging approach to advance the functionality of microdevices. Aluminum (Al) has been of interest as one of the waf...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9413586/ https://www.ncbi.nlm.nih.gov/pubmed/36014143 http://dx.doi.org/10.3390/mi13081221 |