Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization

The assembly of passive components on flexible electronics is essential for the functionalization of circuits. For this purpose, adhesive bonding technology by isotropic conductive adhesive (ICA) is increasingly used in addition to soldering processes. Nevertheless, a comparative study, especially f...

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Detalles Bibliográficos
Autores principales: Saleh, Rafat, Schütt, Sophie, Barth, Maximilian, Lang, Thassilo, Eberhardt, Wolfgang, Zimmermann, André
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9415584/
https://www.ncbi.nlm.nih.gov/pubmed/36014161
http://dx.doi.org/10.3390/mi13081240

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9415584/
https://www.ncbi.nlm.nih.gov/pubmed/36014161
http://dx.doi.org/10.3390/mi13081240

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