Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package

This paper presents the mechanical behaviors of different types of polyimide feedthroughs that are frequently used for implantable polymer encapsulation. Implantable packages of electronic devices often comprise circuits mounted on printed circuit boards (PCBs) encapsulated in a biocompatible polyme...

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Detalles Bibliográficos
Autores principales: Seok, Seonho, Park, HyungDal, Kim, Yong-Jun, Kim, Jinseok
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9415652/
https://www.ncbi.nlm.nih.gov/pubmed/36014217
http://dx.doi.org/10.3390/mi13081295

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9415652/
https://www.ncbi.nlm.nih.gov/pubmed/36014217
http://dx.doi.org/10.3390/mi13081295

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