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Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package
This paper presents the mechanical behaviors of different types of polyimide feedthroughs that are frequently used for implantable polymer encapsulation. Implantable packages of electronic devices often comprise circuits mounted on printed circuit boards (PCBs) encapsulated in a biocompatible polyme...
Autores principales: | Seok, Seonho, Park, HyungDal, Kim, Yong-Jun, Kim, Jinseok |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9415652/ https://www.ncbi.nlm.nih.gov/pubmed/36014217 http://dx.doi.org/10.3390/mi13081295 |
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