Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils

Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the development and application of an innovative inductive heating system using micro coils for rapid Cu-Sn solid-liquid interdiffusion (SLID) bond...

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Detalles Bibliográficos
Autores principales: Hofmann, Christian, Satwara, Maulik, Kroll, Martin, Panhale, Sushant, Rochala, Patrick, Wiemer, Maik, Hiller, Karla, Kuhn, Harald
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9416581/
https://www.ncbi.nlm.nih.gov/pubmed/36014229
http://dx.doi.org/10.3390/mi13081307

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9416581/
https://www.ncbi.nlm.nih.gov/pubmed/36014229
http://dx.doi.org/10.3390/mi13081307

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