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Smart low interfacial toughness coatings for on-demand de-icing without melting
Ice accretion causes problems in vital industries and has been addressed over the past decades with either passive or active de-icing systems. This work presents a smart, hybrid (passive and active) de-icing system through the combination of a low interfacial toughness coating, printed circuit board...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9433454/ https://www.ncbi.nlm.nih.gov/pubmed/36045129 http://dx.doi.org/10.1038/s41467-022-32852-6 |
Sumario: | Ice accretion causes problems in vital industries and has been addressed over the past decades with either passive or active de-icing systems. This work presents a smart, hybrid (passive and active) de-icing system through the combination of a low interfacial toughness coating, printed circuit board heaters, and an ice-detecting microwave sensor. The coating’s interfacial toughness with ice is found to be temperature dependent and can be modulated using the embedded heaters. Accordingly, de-icing is realized without melting the interface. The synergistic combination of the low interfacial toughness coating and periodic heaters results in a greater de-icing power density than a full-coverage heater system. The hybrid de-icing system also shows durability towards repeated icing/de-icing, mechanical abrasion, outdoor exposure, and chemical contamination. A non-contact planar microwave resonator sensor is additionally designed and implemented to precisely detect the presence or absence of water or ice on the surface while operating beneath the coating, further enhancing the system’s energy efficiency. Scalability of the smart coating is demonstrated using large (up to 1 m) iced interfaces. Overall, the smart hybrid system designed here offers a paradigm shift in de-icing that can efficiently render a surface ice-free without the need for energetically expensive interface melting. |
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