Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations...

Descripción completa

Detalles Bibliográficos
Autores principales: Ismail, Adlil Aizat, Bakar, Maria Abu, Ehsan, Abang Annuar, Jalar, Azman, Burke, John, Zolkefli, Zol Effendi, Basiron, Erwan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9448760/
https://www.ncbi.nlm.nih.gov/pubmed/36068289
http://dx.doi.org/10.1038/s41598-022-19436-6

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9448760/
https://www.ncbi.nlm.nih.gov/pubmed/36068289
http://dx.doi.org/10.1038/s41598-022-19436-6

Ejemplares similares