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Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint

This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations...

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Autores principales: Ismail, Adlil Aizat, Bakar, Maria Abu, Ehsan, Abang Annuar, Jalar, Azman, Burke, John, Zolkefli, Zol Effendi, Basiron, Erwan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9448760/
https://www.ncbi.nlm.nih.gov/pubmed/36068289
http://dx.doi.org/10.1038/s41598-022-19436-6
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author Ismail, Adlil Aizat
Bakar, Maria Abu
Ehsan, Abang Annuar
Jalar, Azman
Burke, John
Zolkefli, Zol Effendi
Basiron, Erwan
author_facet Ismail, Adlil Aizat
Bakar, Maria Abu
Ehsan, Abang Annuar
Jalar, Azman
Burke, John
Zolkefli, Zol Effendi
Basiron, Erwan
author_sort Ismail, Adlil Aizat
collection PubMed
description This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly.
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spelling pubmed-94487602022-09-08 Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint Ismail, Adlil Aizat Bakar, Maria Abu Ehsan, Abang Annuar Jalar, Azman Burke, John Zolkefli, Zol Effendi Basiron, Erwan Sci Rep Article This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder joints on double-sided printed circuit board assembly. Three types of heat shield placement locations were used: sample X, individual heat shield placement on adjacent components of the rework location; sample Y, a U-shaped, and sample Z, a square-shaped heat shield placed respectively at the heat source location. The dye and pull test results, infrared thermography, and temperature measurements were analysed to understand the relationship between the location of the heat shield and solder joint damage during rework. Heat shield placement at the heat source location on the reworked component can reduce the peak temperatures on the adjacent rework component locations by up to 8.18%. The peak temperatures of the centre and corner of the BGA component can be maintained below 195 °C and 210 °C, respectively to improve the adjacent rework component locations' solder joint quality by reducing solder joint damage by more than 50% solder cracks. This is useful for thermal management during rework involving high-density ball grid array component placements on double-sided printed circuit board assembly. Nature Publishing Group UK 2022-09-06 /pmc/articles/PMC9448760/ /pubmed/36068289 http://dx.doi.org/10.1038/s41598-022-19436-6 Text en © The Author(s) 2022 https://creativecommons.org/licenses/by/4.0/Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) .
spellingShingle Article
Ismail, Adlil Aizat
Bakar, Maria Abu
Ehsan, Abang Annuar
Jalar, Azman
Burke, John
Zolkefli, Zol Effendi
Basiron, Erwan
Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
title Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
title_full Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
title_fullStr Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
title_full_unstemmed Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
title_short Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
title_sort effect of heat shield locations on rework-induced thermal management in ball grid array solder joint
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9448760/
https://www.ncbi.nlm.nih.gov/pubmed/36068289
http://dx.doi.org/10.1038/s41598-022-19436-6
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