Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration

This paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation...

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Detalles Bibliográficos
Autores principales: Yu, Weihua, Vosoogh, Abbas, Wang, Bowu, He, Zhongxia Simon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9460755/
https://www.ncbi.nlm.nih.gov/pubmed/36081156
http://dx.doi.org/10.3390/s22176696

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9460755/
https://www.ncbi.nlm.nih.gov/pubmed/36081156
http://dx.doi.org/10.3390/s22176696

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