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Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration
This paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9460755/ https://www.ncbi.nlm.nih.gov/pubmed/36081156 http://dx.doi.org/10.3390/s22176696 |