A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation

With the development of miniaturization and integration of electronic devices, the conventional manifold microchannels (MMCs) structure has been unable to meet the heat dissipation requirements caused by the rapid growth of internal heat flux. There is an urgent need to design a new heat dissipation...

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Detalles Bibliográficos
Autores principales: Yang, Xing, Lin, Kabin, Zhang, Daxing, Liu, Shaoyi, Han, Baoqing, Wang, Zhihai, Yu, Kunpeng, Wu, Wenzhi, Ge, Dongming, Wang, Congsi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9503348/
https://www.ncbi.nlm.nih.gov/pubmed/36144043
http://dx.doi.org/10.3390/mi13091420

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9503348/
https://www.ncbi.nlm.nih.gov/pubmed/36144043
http://dx.doi.org/10.3390/mi13091420

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