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C-Axis Textured, 2–3 μm Thick Al(0.75)Sc(0.25)N Films Grown on Chemically Formed TiN/Ti Seeding Layers for MEMS Applications
A protocol for successfully depositing [001] textured, 2–3 µm thick films of Al(0.75)Sc(0.25)N, is proposed. The procedure relies on the fact that sputtered Ti is [001]-textured [Formula: see text]-phase (hcp). Diffusion of nitrogen ions into the α-Ti film during reactive sputtering of Al(0.75),Sc(0...
Autores principales: | , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504120/ https://www.ncbi.nlm.nih.gov/pubmed/36146391 http://dx.doi.org/10.3390/s22187041 |
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author | Cohen, Asaf Cohen, Hagai Cohen, Sidney R. Khodorov, Sergey Feldman, Yishay Kossoy, Anna Kaplan-Ashiri, Ifat Frenkel, Anatoly Wachtel, Ellen Lubomirsky, Igor Ehre, David |
author_facet | Cohen, Asaf Cohen, Hagai Cohen, Sidney R. Khodorov, Sergey Feldman, Yishay Kossoy, Anna Kaplan-Ashiri, Ifat Frenkel, Anatoly Wachtel, Ellen Lubomirsky, Igor Ehre, David |
author_sort | Cohen, Asaf |
collection | PubMed |
description | A protocol for successfully depositing [001] textured, 2–3 µm thick films of Al(0.75)Sc(0.25)N, is proposed. The procedure relies on the fact that sputtered Ti is [001]-textured [Formula: see text]-phase (hcp). Diffusion of nitrogen ions into the α-Ti film during reactive sputtering of Al(0.75),Sc(0.25)N likely forms a [111]-oriented TiN intermediate layer. The lattice mismatch of this very thin film with Al(0.75)Sc(0.25)N is ~3.7%, providing excellent conditions for epitaxial growth. In contrast to earlier reports, the Al(0.75)Sc(0.25)N films prepared in the current study are Al-terminated. Low growth stress (<100 MPa) allows films up to 3 µm thick to be deposited without loss of orientation or decrease in piezoelectric coefficient. An advantage of the proposed technique is that it is compatible with a variety of substrates commonly used for actuators or MEMS, as demonstrated here for both Si wafers and D263 borosilicate glass. Additionally, thicker films can potentially lead to increased piezoelectric stress/strain by supporting application of higher voltage, but without increase in the magnitude of the electric field. |
format | Online Article Text |
id | pubmed-9504120 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-95041202022-09-24 C-Axis Textured, 2–3 μm Thick Al(0.75)Sc(0.25)N Films Grown on Chemically Formed TiN/Ti Seeding Layers for MEMS Applications Cohen, Asaf Cohen, Hagai Cohen, Sidney R. Khodorov, Sergey Feldman, Yishay Kossoy, Anna Kaplan-Ashiri, Ifat Frenkel, Anatoly Wachtel, Ellen Lubomirsky, Igor Ehre, David Sensors (Basel) Article A protocol for successfully depositing [001] textured, 2–3 µm thick films of Al(0.75)Sc(0.25)N, is proposed. The procedure relies on the fact that sputtered Ti is [001]-textured [Formula: see text]-phase (hcp). Diffusion of nitrogen ions into the α-Ti film during reactive sputtering of Al(0.75),Sc(0.25)N likely forms a [111]-oriented TiN intermediate layer. The lattice mismatch of this very thin film with Al(0.75)Sc(0.25)N is ~3.7%, providing excellent conditions for epitaxial growth. In contrast to earlier reports, the Al(0.75)Sc(0.25)N films prepared in the current study are Al-terminated. Low growth stress (<100 MPa) allows films up to 3 µm thick to be deposited without loss of orientation or decrease in piezoelectric coefficient. An advantage of the proposed technique is that it is compatible with a variety of substrates commonly used for actuators or MEMS, as demonstrated here for both Si wafers and D263 borosilicate glass. Additionally, thicker films can potentially lead to increased piezoelectric stress/strain by supporting application of higher voltage, but without increase in the magnitude of the electric field. MDPI 2022-09-17 /pmc/articles/PMC9504120/ /pubmed/36146391 http://dx.doi.org/10.3390/s22187041 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Cohen, Asaf Cohen, Hagai Cohen, Sidney R. Khodorov, Sergey Feldman, Yishay Kossoy, Anna Kaplan-Ashiri, Ifat Frenkel, Anatoly Wachtel, Ellen Lubomirsky, Igor Ehre, David C-Axis Textured, 2–3 μm Thick Al(0.75)Sc(0.25)N Films Grown on Chemically Formed TiN/Ti Seeding Layers for MEMS Applications |
title | C-Axis Textured, 2–3 μm Thick Al(0.75)Sc(0.25)N Films Grown on Chemically Formed TiN/Ti Seeding Layers for MEMS Applications |
title_full | C-Axis Textured, 2–3 μm Thick Al(0.75)Sc(0.25)N Films Grown on Chemically Formed TiN/Ti Seeding Layers for MEMS Applications |
title_fullStr | C-Axis Textured, 2–3 μm Thick Al(0.75)Sc(0.25)N Films Grown on Chemically Formed TiN/Ti Seeding Layers for MEMS Applications |
title_full_unstemmed | C-Axis Textured, 2–3 μm Thick Al(0.75)Sc(0.25)N Films Grown on Chemically Formed TiN/Ti Seeding Layers for MEMS Applications |
title_short | C-Axis Textured, 2–3 μm Thick Al(0.75)Sc(0.25)N Films Grown on Chemically Formed TiN/Ti Seeding Layers for MEMS Applications |
title_sort | c-axis textured, 2–3 μm thick al(0.75)sc(0.25)n films grown on chemically formed tin/ti seeding layers for mems applications |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504120/ https://www.ncbi.nlm.nih.gov/pubmed/36146391 http://dx.doi.org/10.3390/s22187041 |
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