High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing

Copper (Cu) removal efficiency is a key parameter in the processing of Cu-based electronic devices. Herein, a nitrogen plasma-assisted picosecond (ps) laser process for Cu removal is presented. Based on the cleaning and activation effect of nitrogen plasma on the surface of Cu film in ps-laser ablat...

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Detalles Bibliográficos
Autores principales: Li, Yunfan, Guo, Xuanqi, Wang, Shuai, Zhang, Shizhuo, Zhao, Yilin, Guo, Dingyi, Zhang, Chen, Liu, Sheng, Cheng, Gary J., Liu, Feng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504670/
https://www.ncbi.nlm.nih.gov/pubmed/36144115
http://dx.doi.org/10.3390/mi13091492

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504670/
https://www.ncbi.nlm.nih.gov/pubmed/36144115
http://dx.doi.org/10.3390/mi13091492

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