High Quality Pt–Pt Metal Bonding for High Temperature Packaging

Platinum is an ideal material for high-temperature resistant device packaging due to its higher melting point and good electrical properties. In this paper, the thermocompression bonding of Pt–Pt metal electrodes was successfully realized through process exploration, and the package interconnection...

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Detalles Bibliográficos
Autores principales: Liu, Jiazheng, Wang, Junqiang, Li, Mengwei, Zhang, Haikun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504676/
https://www.ncbi.nlm.nih.gov/pubmed/36144165
http://dx.doi.org/10.3390/mi13091543

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9504676/
https://www.ncbi.nlm.nih.gov/pubmed/36144165
http://dx.doi.org/10.3390/mi13091543

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