Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives

Interconnections are essential for integrating the packaging substrate, and defect-free copper-filling can further improve the reliability in through holes (THs). The coating properties and filling processes are mainly dominated by the interplays among additives in the direct current electroplating....

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Detalles Bibliográficos
Autores principales: Wang, Qing, Peng, Yang, Mou, Yun, Chen, Mingxiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9505335/
https://www.ncbi.nlm.nih.gov/pubmed/36144162
http://dx.doi.org/10.3390/mi13091539

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9505335/
https://www.ncbi.nlm.nih.gov/pubmed/36144162
http://dx.doi.org/10.3390/mi13091539

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