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Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives
Interconnections are essential for integrating the packaging substrate, and defect-free copper-filling can further improve the reliability in through holes (THs). The coating properties and filling processes are mainly dominated by the interplays among additives in the direct current electroplating....
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9505335/ https://www.ncbi.nlm.nih.gov/pubmed/36144162 http://dx.doi.org/10.3390/mi13091539 |