Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint

Predictive analysis of the life of an electronic package requires a sequence of processes involving: (i) development of a finite element (FE) model, (ii) correlation of the FE model using experimental data, and (iii) development of a local model using the correlated FE model. The life of the critica...

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Detalles Bibliográficos
Autores principales: Doranga, Sushil, Schuldt, Matthew, Khanal, Mukunda
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9506576/
https://www.ncbi.nlm.nih.gov/pubmed/36143520
http://dx.doi.org/10.3390/ma15186208

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9506576/
https://www.ncbi.nlm.nih.gov/pubmed/36143520
http://dx.doi.org/10.3390/ma15186208

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