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Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint
Predictive analysis of the life of an electronic package requires a sequence of processes involving: (i) development of a finite element (FE) model, (ii) correlation of the FE model using experimental data, and (iii) development of a local model using the correlated FE model. The life of the critica...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9506576/ https://www.ncbi.nlm.nih.gov/pubmed/36143520 http://dx.doi.org/10.3390/ma15186208 |