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Grain boundary passivation via balancing feedback of hole barrier modulation in HfO(2-x) for nanoscale flexible electronics
Flexible electronics has attracted considerable attention owing to its enormous potential for practical applications in various fields. However, the massive strain produced during bending degrades the device. Especially at grain boundaries, due to the accumulation of defects, this degradation is exa...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Springer Nature Singapore
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9525481/ https://www.ncbi.nlm.nih.gov/pubmed/36180643 http://dx.doi.org/10.1186/s40580-022-00336-4 |