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Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging
In this work, various Cu, Ni, Ag-microalloyed Sn–5Sb/Cu joints, ordinary Sn–5Sb/Cu joints, and low-melting-point Sn–3Ag–0.5Cu (SAC305)/Cu (used for comparison) were prepared, focusing on the influence of Cu, Ni, and Ag on the microstructure evolution, interfacial IMC growth, and microhardness of Sn–...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer US
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9533998/ http://dx.doi.org/10.1007/s10854-022-09210-9 |