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Vertically Integrated Electronics: New Opportunities from Emerging Materials and Devices
Vertical three-dimensional (3D) integration is a highly attractive strategy to integrate a large number of transistor devices per unit area. This approach has emerged to accommodate the higher demand of data processing capability and to circumvent the scaling limitation. A huge number of research ef...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer Nature Singapore
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9547046/ https://www.ncbi.nlm.nih.gov/pubmed/36205848 http://dx.doi.org/10.1007/s40820-022-00942-1 |