Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high therm...

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Detalles Bibliográficos
Autores principales: Xing, Wenkui, Xu, Yue, Song, Chengyi, Deng, Tao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9565324/
https://www.ncbi.nlm.nih.gov/pubmed/36234498
http://dx.doi.org/10.3390/nano12193365

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9565324/
https://www.ncbi.nlm.nih.gov/pubmed/36234498
http://dx.doi.org/10.3390/nano12193365

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