Pre-Ball-Milled Boron Nitride for the Preparation of Boron Nitride/Polyetherimide Nanocomposite Film with Enhanced Breakdown Strength and Mechanical Properties for Thermal Management

Modern electronics not only require the thermal management ability of polymer packaging materials but also need anti-voltage and mechanical properties. Boron nitride nanosheets (BNNS), an ideal thermally conductive and high withstand voltage (800 kV/mm) filler, can meet application needs, but the co...

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Detalles Bibliográficos
Autores principales: Li, Ruiyi, Yang, Xiao, Li, Jian, Liu, Ding, Zhang, Lixin, Chen, Haisheng, Zheng, Xinghua, Zhang, Ting
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9565508/
https://www.ncbi.nlm.nih.gov/pubmed/36234599
http://dx.doi.org/10.3390/nano12193473

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9565508/
https://www.ncbi.nlm.nih.gov/pubmed/36234599
http://dx.doi.org/10.3390/nano12193473

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