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Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching

The growing need for increasingly miniaturized devices has placed high importance and demands on nanofabrication technologies with high-quality, low temperatures, and low-cost techniques. In the past few years, the development and recent advances in atomic layer deposition (ALD) processes boosted in...

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Autores principales: Chiappim, William, Neto, Benedito Botan, Shiotani, Michaela, Karnopp, Júlia, Gonçalves, Luan, Chaves, João Pedro, Sobrinho, Argemiro da Silva, Leitão, Joaquim Pratas, Fraga, Mariana, Pessoa, Rodrigo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9565849/
https://www.ncbi.nlm.nih.gov/pubmed/36234624
http://dx.doi.org/10.3390/nano12193497
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author Chiappim, William
Neto, Benedito Botan
Shiotani, Michaela
Karnopp, Júlia
Gonçalves, Luan
Chaves, João Pedro
Sobrinho, Argemiro da Silva
Leitão, Joaquim Pratas
Fraga, Mariana
Pessoa, Rodrigo
author_facet Chiappim, William
Neto, Benedito Botan
Shiotani, Michaela
Karnopp, Júlia
Gonçalves, Luan
Chaves, João Pedro
Sobrinho, Argemiro da Silva
Leitão, Joaquim Pratas
Fraga, Mariana
Pessoa, Rodrigo
author_sort Chiappim, William
collection PubMed
description The growing need for increasingly miniaturized devices has placed high importance and demands on nanofabrication technologies with high-quality, low temperatures, and low-cost techniques. In the past few years, the development and recent advances in atomic layer deposition (ALD) processes boosted interest in their use in advanced electronic and nano/microelectromechanical systems (NEMS/MEMS) device manufacturing. In this context, non-thermal plasma (NTP) technology has been highlighted because it allowed the ALD technique to expand its process window and the fabrication of several nanomaterials at reduced temperatures, allowing thermosensitive substrates to be covered with good formability and uniformity. In this review article, we comprehensively describe how the NTP changed the ALD universe and expanded it in device fabrication for different applications. We also present an overview of the efforts and developed strategies to gather the NTP and ALD technologies with the consecutive formation of plasma-assisted ALD (PA-ALD) technique, which has been successfully applied in nanofabrication and surface modification. The advantages and limitations currently faced by this technique are presented and discussed. We conclude this review by showing the atomic layer etching (ALE) technique, another development of NTP and ALD junction that has gained more and more attention by allowing significant advancements in plasma-assisted nanofabrication.
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spelling pubmed-95658492022-10-15 Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching Chiappim, William Neto, Benedito Botan Shiotani, Michaela Karnopp, Júlia Gonçalves, Luan Chaves, João Pedro Sobrinho, Argemiro da Silva Leitão, Joaquim Pratas Fraga, Mariana Pessoa, Rodrigo Nanomaterials (Basel) Review The growing need for increasingly miniaturized devices has placed high importance and demands on nanofabrication technologies with high-quality, low temperatures, and low-cost techniques. In the past few years, the development and recent advances in atomic layer deposition (ALD) processes boosted interest in their use in advanced electronic and nano/microelectromechanical systems (NEMS/MEMS) device manufacturing. In this context, non-thermal plasma (NTP) technology has been highlighted because it allowed the ALD technique to expand its process window and the fabrication of several nanomaterials at reduced temperatures, allowing thermosensitive substrates to be covered with good formability and uniformity. In this review article, we comprehensively describe how the NTP changed the ALD universe and expanded it in device fabrication for different applications. We also present an overview of the efforts and developed strategies to gather the NTP and ALD technologies with the consecutive formation of plasma-assisted ALD (PA-ALD) technique, which has been successfully applied in nanofabrication and surface modification. The advantages and limitations currently faced by this technique are presented and discussed. We conclude this review by showing the atomic layer etching (ALE) technique, another development of NTP and ALD junction that has gained more and more attention by allowing significant advancements in plasma-assisted nanofabrication. MDPI 2022-10-06 /pmc/articles/PMC9565849/ /pubmed/36234624 http://dx.doi.org/10.3390/nano12193497 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Chiappim, William
Neto, Benedito Botan
Shiotani, Michaela
Karnopp, Júlia
Gonçalves, Luan
Chaves, João Pedro
Sobrinho, Argemiro da Silva
Leitão, Joaquim Pratas
Fraga, Mariana
Pessoa, Rodrigo
Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching
title Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching
title_full Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching
title_fullStr Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching
title_full_unstemmed Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching
title_short Plasma-Assisted Nanofabrication: The Potential and Challenges in Atomic Layer Deposition and Etching
title_sort plasma-assisted nanofabrication: the potential and challenges in atomic layer deposition and etching
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9565849/
https://www.ncbi.nlm.nih.gov/pubmed/36234624
http://dx.doi.org/10.3390/nano12193497
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