The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

The surface finish (SF) becomes a part of the solder joint during assembly and improves the component’s reliability. Furthermore, the SF influences the solder joint’s reliability by affecting the thickness of the intermetallic compound (IMC) layer at the solder interface and copper pads. In this exp...

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Detalles Bibliográficos
Autores principales: Akkara, Francy John, Hamasha, Sa’d, Alahmer, Ali, Evans, John, Belhadi, Mohamed El Amine, Wei, Xin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9570697/
https://www.ncbi.nlm.nih.gov/pubmed/36234099
http://dx.doi.org/10.3390/ma15196759

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9570697/
https://www.ncbi.nlm.nih.gov/pubmed/36234099
http://dx.doi.org/10.3390/ma15196759

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