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Thermal Conductivity Stability of Interfacial in Situ Al(4)C(3) Engineered Diamond/Al Composites Subjected to Thermal Cycling

The stability of the thermal properties of diamond/Al composites during thermal cycling is crucial to their thermal management applications. In this study, we realize a well-bonded interface in diamond/Al composites by interfacial in situ Al(4)C(3) engineering. As a result, the excellent stability o...

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Detalles Bibliográficos
Autores principales: Li, Ning, Hao, Jinpeng, Zhang, Yongjian, Wang, Wei, Zhao, Jie, Wu, Haijun, Wang, Xitao, Zhang, Hailong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9571598/
https://www.ncbi.nlm.nih.gov/pubmed/36233982
http://dx.doi.org/10.3390/ma15196640