Test Structure Design for Defect Detection during Active Thermal Cycling

Integrated power ICs acting as smart power switches for automotive or industrial applications are often subjected to active thermal cycling. Consequently, they undergo significant self-heating and are prone to various failure mechanisms related to the electro-thermo-mechanical phenomena that take pl...

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Detalles Bibliográficos
Autores principales: Florea, Ciprian, Simon, Dan, Bojiță, Adrian, Purcar, Marius, Boianceanu, Cristian, Țopa, Vasile
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9572893/
https://www.ncbi.nlm.nih.gov/pubmed/36236320
http://dx.doi.org/10.3390/s22197223

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9572893/
https://www.ncbi.nlm.nih.gov/pubmed/36236320
http://dx.doi.org/10.3390/s22197223

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