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Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars

[Image: see text] Highly uniform Cu micropillars were electrodeposited on a Cu seed layer in a micropatterned photoresist in the presence of binary levelers containing pyrrolidine and pyridine functional groups. The adsorption behaviors of binary levelers, i.e., 3-hydroxy-6-(tert-butyl)pyridine and...

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Autores principales: Jo, Yugeun, Kim, Sung-Min, Jin, SangHoon, Lee, Woon Young, Lee, Sang-Yul, Lee, Min Hyung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2022
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9583340/
https://www.ncbi.nlm.nih.gov/pubmed/36278072
http://dx.doi.org/10.1021/acsomega.2c05646
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author Jo, Yugeun
Kim, Sung-Min
Jin, SangHoon
Lee, Woon Young
Lee, Sang-Yul
Lee, Min Hyung
author_facet Jo, Yugeun
Kim, Sung-Min
Jin, SangHoon
Lee, Woon Young
Lee, Sang-Yul
Lee, Min Hyung
author_sort Jo, Yugeun
collection PubMed
description [Image: see text] Highly uniform Cu micropillars were electrodeposited on a Cu seed layer in a micropatterned photoresist in the presence of binary levelers containing pyrrolidine and pyridine functional groups. The adsorption behaviors of binary levelers, i.e., 3-hydroxy-6-(tert-butyl)pyridine and pyridinium tribromide in an electroplating bath were investigated by chronopotentiometry with sequential injection of levelers and linear sweep voltammetry with a rotating disk electrode. From electrochemical analysis, pyridinium tribromide composed of a positively charged pyridine ring was strongly adsorbed on the Cu seed surface, relative to 3-hydroxy-6-(tert-butyl)pyridine. Additional microscopy, surface roughness, and nitrogen concentration analyses revealed that the binary levelers were preferentially adsorbed on the center and the edge region of the Cu seed, resulting in a uniform Cu pillar profile. The possible mechanism of highly uniform Cu pillar deposition was discussed in terms of the adsorption behaviors of the levelers dependent on their molecular structures.
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spelling pubmed-95833402022-10-21 Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars Jo, Yugeun Kim, Sung-Min Jin, SangHoon Lee, Woon Young Lee, Sang-Yul Lee, Min Hyung ACS Omega [Image: see text] Highly uniform Cu micropillars were electrodeposited on a Cu seed layer in a micropatterned photoresist in the presence of binary levelers containing pyrrolidine and pyridine functional groups. The adsorption behaviors of binary levelers, i.e., 3-hydroxy-6-(tert-butyl)pyridine and pyridinium tribromide in an electroplating bath were investigated by chronopotentiometry with sequential injection of levelers and linear sweep voltammetry with a rotating disk electrode. From electrochemical analysis, pyridinium tribromide composed of a positively charged pyridine ring was strongly adsorbed on the Cu seed surface, relative to 3-hydroxy-6-(tert-butyl)pyridine. Additional microscopy, surface roughness, and nitrogen concentration analyses revealed that the binary levelers were preferentially adsorbed on the center and the edge region of the Cu seed, resulting in a uniform Cu pillar profile. The possible mechanism of highly uniform Cu pillar deposition was discussed in terms of the adsorption behaviors of the levelers dependent on their molecular structures. American Chemical Society 2022-10-05 /pmc/articles/PMC9583340/ /pubmed/36278072 http://dx.doi.org/10.1021/acsomega.2c05646 Text en © 2022 The Authors. Published by American Chemical Society https://creativecommons.org/licenses/by-nc-nd/4.0/Permits non-commercial access and re-use, provided that author attribution and integrity are maintained; but does not permit creation of adaptations or other derivative works (https://creativecommons.org/licenses/by-nc-nd/4.0/).
spellingShingle Jo, Yugeun
Kim, Sung-Min
Jin, SangHoon
Lee, Woon Young
Lee, Sang-Yul
Lee, Min Hyung
Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars
title Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars
title_full Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars
title_fullStr Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars
title_full_unstemmed Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars
title_short Complementary Adsorption of Binary Levelers for Highly Uniform Cu Micropillars
title_sort complementary adsorption of binary levelers for highly uniform cu micropillars
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9583340/
https://www.ncbi.nlm.nih.gov/pubmed/36278072
http://dx.doi.org/10.1021/acsomega.2c05646
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